Suss MicroTec today debuted a full field proximity mask aligner for processing 300mm wafers. The MA300Plus is optimized for high-volume, high-end fabs, the company said, and is capable of a throughput ...
Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
The pre-aligner determines wafer position and orientation in less than half a second while mechanical pre-aligners must typically spin wafers for several seconds. NotchMax, the newest member of the ...
Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...
SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...
New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...
FREMONT, CA / ACCESSWIRE / January 5, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it has ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...
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