Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--The international EMC-3D semiconductor equipment and materials consortium today announced that Applied Materials, Inc. (Nasdaq:AMAT) has joined the organization.

Tokyo Institute of Technology (Tokyo Tech) WOW Alliance and the National Cheng Kung University (hereinafter, NCKU) agree on a technical partnership to promote the social implementation (practical ...

When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...

SENDAI, Japan--(BUSINESS WIRE)--Today at the IEEE 3DIC conference, Tezzaron Semiconductor and their manufacturing subsidiary, Novati Technologies, announce the world’s first eight-layer 3D IC wafer ...

SINGAPORE--A new consortium has been established to advance the country's next-generation 300mm wafer manufacturing capabilities, by focusing on a technology for three-dimensional integrated circuits ...

3D TSV stacking technology is expected to account for the largest share of the 3D stacking market during the forecast period TSV technology is instrumental in the development of 3D stacking DRAMs, ...

UnitySC continues to innovate its inspection and metrology products to deliver solutions that address the most advanced needs across semiconductor manufacturing processes. GRENOBLE, France, July 9, ...

EVG's new integrated in-line metrology module can detect a variety of process irregularities and defects during temporary bonding and debonding, including: total thickness variation (TTV) of the ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...