Hosted on MSN

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
Digi Times

Panel makers pivot to chip packaging as consumer electronics stall

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...
TweakTown

Samsung reportedly ahead of TSMC with next-gen panel-level packaging semiconductor tech

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...
manilatimes

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc.
Seeking Alpha

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced ...