We talk a lot about process nodes at ExtremeTech, but we don't often refer back to what a process node technically is. With Intel's 10nm node now in production and TSMC + Samsung talking about future ...

Intel Foundry Services (IFS) and leading semiconductor IP vendor Arm have jointly announced a design technology co-optimization (DTCO) agreement to develop multiple generations of Arm-based processor ...

Prior to becoming the CEO of VMWare in 2012, Pat Gelsinger was a long-time Intel employee dating back to the Andy Grove era and Chief Technology Officer under Craig Barrett and Paul Otellini. It’s ...

At its Vision 2025 conference, Intel announced today that it has entered risk production of its 18A process node. This crucial production milestone signifies that the node is now in the early stages ...

TSMC is bolstering its existing relationships with EDA companies by having their design tools certified for its N3E and N2 process nodes. Top EDA firms have announced a range of new certifications and ...

Intel has made some major changes and announcements concerning upcoming products and how future improvements to the company's manufacturing will be communicated. These changes will have a significant ...

Bottom line: Intel executives love to tell a good story about the company's ability to innovate and do it fast enough to catch the competition, but it's difficult to take them seriously when the ...

Cadence 20.1 digital full flow tuned for Samsung Foundry advanced-process nodes, enabling optimal PPA and first-pass silicon success HPC reference flows based on iSpatial technology enable rapid ...

TL;DR: TSMC plans to start mass production of its A16 process node in Taiwan by 2026 and expand to Arizona by 2028. TSMC is expected to begin mass production of its next-gen A16 process node in Taiwan ...

It's no secret that the process behind the manufacturing of high-end processors is becoming ever more expensive with each advance in technology. The huge outlay in buildings and machinery, as well as ...

Intel Corporation today announced a detailed process and packaging technology roadmaps of “foundational innovations” for products through 2025 and beyond. In addition to announcing RibbonFET, its ...