TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its Power Device Works’ Fukuyama Factory has begun large-scale supply of power semiconductor chips made from ...
Universal semi-automated platform measures diverse wafer materials and surfaces with SEMI and ASTM standard compliance.
At Opening Ceremony, Renesas Pledges to Expand its Power Semiconductor Production Capacity to Support Growing Demand of EVs TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (“Renesas,” TSE:6723 ...
Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater China distributor MS ...
Demand for AI servers' power management chips is surging, tightening supply and demand in the 8-inch wafer foundry market. Powerchip Semiconductor Manufacturing Corporation (PSMC) plans to raise ...
The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the ...
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office ...
Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
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