Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, Oct. 15, 2025 /PRNewswire/ -- ...
An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...
Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
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