Via Technologies is not likely to ship its supersmall Mobile ITX motherboard, aimed at ultramobile PCs (UMPCs) and other light portable devices, in production volume until next year, company officials ...
VIA Technologies has announced the VIA EPIA-T700, the first motherboard based on the recently announced Mobile-ITX form factor. Measuring 6×6cm, the VIA EPIA-T700 is a compact... VIA Technologies has ...
'Manufacturability issues' prevent Via's supersmall Mobile ITX motherboard from being used in UMPCs and other portable devices this year Via Technologies is not likely to ship its supersmall Mobile ...
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