Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

There are a number of complex tasks involved in the manufacturing of electronic assemblies, all of which can go wrong. In order to ensure quality standards are met, the fabrication of the printed ...

In-circuit test (ICT) has been instrumental in identifying manufacturing process defects and component defects on countless varieties of populated printed circuit board (PCB) assemblies for more than ...

GOEPEL electronic has announced the availability of boundary-scan integration into SPEA’s multicore ICT (in-circuit-test) platform. With the level of integration provided for the SPEA 3030 ICT system, ...