This FAQ will look at how a PC board loaded with anywhere from just a few to hundreds of components is soldered in one smooth process, and the fascinating technology and systems it takes to do that.

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...

Motorola designed its 16-pin PFP-16 power flat package for RF power amplifiers and similar components. You can attach and solder this surface-mount package to the pc board using the same standard ...