Failure analysis of ICs requires a quick and proper response because, of course, helping a customer is our main concern. But should we expect the quality assurance (QA) department to test every ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

USI has developed advanced electronic component failure analysis (FA) technology to meet the increasingly complex and diverse needs of SiP miniaturized products. Save my User ID and Password Some ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...