Modeling and simulation is an efficient way of analyzing packaging and testing processes to develop a strong understanding of how they may impact designs and performance. Multiphysics simulation ...

The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...

In today’s competitive retail landscape, packaging has evolved far beyond its basic purpose of protection. It has become a ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...