Semiconductor manufacturers rely on latch-up tests to characterize ICs for susceptibility to electrical failure. Engineers can use various methods to perform latch-up tests, but the only standard that ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

All semiconductor devices are sensitive to electrostatic discharge (ESD) damage to varying degrees. This is true whether they are soldered to a PC board in an application, or whether they are ...

To connect the miniature world of integrated circuits like a CPU with the outside world, a number of physical connections have to be made. Although this may seem straightforward, these I/O pads form a ...