With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
Forward-looking: Memory technology has continuously improved over the last decade to meet the increasing demand for higher bit density, performance, and energy efficiency. Micron is touting new ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback