Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Pellet extrusion is under increasing pressure to reduce energy use and material waste while maintaining consistent pellet ...