Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2042 socket is designed for a 4.47mmx4.34mm package size and operates at ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...

There has been much speculation in the industry about whether Intel will stop making LGA package processors in favour of BGA package processors. Well, this speculation may have some traction in the ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...