After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

In future high-tech industries, such as high-speed optical computing for massive AI, quantum cryptographic communication, and ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication ...

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...

Researchers from LP3 Laboratory, France developed a light-based technique for local material processing anywhere in the three-dimensional space of semiconductor chips. The direct laser writing of new ...

HSINCHU, Taiwan--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the Open Innovation Platform ® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC ...

Based on Tower’s advanced 65nm Stacked BSI CIS platform with hybrid bonding for advanced ToF (Time-of-Flight) and Global Shutter sensors Providing state-of-the-art imaging solutions addressing the ...

ALBUQUERQUE, N.M.--(BUSINESS WIRE)--Optomec, the leading manufacturer of 3D Electronics Printers, announced the release of a new production control software product designed specifically for high ...

NEO Semiconductor has unveiled its "3D X-DRAM", which it is pitching as the world's first 3D NAND-like DRAM cell array. Based on Neo's estimates, 3D X-DRAM technology can achieve 128 Gb density with ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...